Wirebond AOI Machine

Wirebond AOI Machine

Description

The Wirebond AOI Machine stands as a cutting-edge solution for inspecting critical components in semiconductor manufacturing, offering advanced features for defect detection and precise parameter measurement in wirebond, die, and epoxy applications.

Features

• 3D Profiling Technology:
  The Wirebond AOI Machine incorporates state-of-the-art 3D profiling technology, enabling detailed and accurate inspection of wirebond, die, and epoxy features for enhanced defect detection.
• Camera Resolution up to 67 megapixels:
  With an impressive camera resolution of up to 67 megapixels, the machine ensures high-quality imaging for precise inspection and analysis of wirebond structures.
• Inspects Wirebond, Die, and Epoxy Defects:
  The machine is designed to comprehensively inspect wirebond connections, die attachment, and epoxy application, ensuring the detection of various defects in these critical areas.
• Inspect Gold, Aluminum, Copper, and Silver Wires:
  Offering versatility, the system is capable of inspecting wirebonds made from various materials, including gold, aluminum, copper, and silver, ensuring compatibility with diverse manufacturing processes.
• Measure Ball, Wedge, Stitch, and Loop Parameters:
  The Wirebond AOI Machine goes beyond visual inspection by precisely measuring essential parameters such as ball, wedge, stitch, and loop characteristics, providing comprehensive data for quality assessment.
• Modular and Scalable Design:
  Featuring a modular and scalable design, the machine adapts to different production requirements and allows for easy integration into existing manufacturing setups.
• Conveyor and Gripper Type:
  The system offers flexibility in handling with both conveyor and gripper types, accommodating different material handling preferences based on the production environment.
• Accuracy up to 2.7um/pixel:
  Achieving high precision, the machine boasts an accuracy of up to 2.7 micrometers per pixel, ensuring reliable inspection results even for minute features.
• Centralized Recipe Management System:
  Streamlining operations, the centralized recipe management system facilitates efficient configuration and management of inspection parameters for various wirebond and die configurations.
• Multiple Reject Handling (Emap, Wire Breaker, Wire Cut, Laser Cut, Puncher):
  The machine offers diverse reject handling options, including Emap, Wire Breaker, Wire Cut, Laser Cut, and Puncher, providing flexibility in dealing with identified defects.
• Throughput up to 30K UPH:
  With an impressive throughput of up to 30,000 units per hour (UPH), the Wirebond AOI Machine ensures rapid and efficient inspection, contributing to high-volume production processes.