Wafer AOI Dedicated for Invisible µCrack on Sawn Wafer

Wafer AOI Dedicated for Invisible µCrack on Sawn Wafer

Description

Specialized in sub-surface optical inspection, it deeply penetrates silicon layers to capture invisible micro-cracks before they compromise component reliability in downstream packaging.

Features

• Sub-Surface µCrack Detection:
  Penetrate deep silicon layers with unprecedented optical transmission, effortlessly scanning through heavily doped wafers to expose hidden sub-surface micro-cracks.
• Zero-Conversion Versatility:
  Transition between wafer configurations seamlessly with minimum to zero mechanical tool conversion, maximizing production uptime.
• Dual-Gate AI Detection:
  Combine high-speed rule-based algorithms with deep-learning AI models to capture subtle internal flaws while keeping false overkill rates exceptionally low.
• Vibration-Isolated Granite Stage:
  Eliminate cleanroom micro-vibrations using a heavy granite motion base to maintain sub-micron imaging stability during high-speed scanning.
• Multi-Channel Optics & Lighting:
  Enhance defect contrast across dynamic substrate conditions using versatile multi-channel illumination and multi-magnification zoom optics.
• Auto Defect Classification (ADC) & Review:
  Automate flaw categorization in real time and streamline offline verification using intuitive review software integrated with SPC data tracking.
• Scalable Performance Upgrades:
  Protect your investment with a modular architecture that easily scales for higher optics resolution, software enhancements, or throughput boosts as your needs grow.