Wafer AOI Designed for 2D Surface Inspection & 3D Metrology

Wafer AOI Designed for 2D Surface Inspection & 3D Metrology

Description

Combining comprehensive 2D surface inspection with high-precision 3D bump metrology, it captures micro-defects and measures critical features with unparalleled accuracy to ensure flawless wafer integrity.

Features

• 2D Inspection & 3D Metrology:
  Execute complete 2D surface defect detection across die surfaces, probe marks, saw lines, and bumps while performing ultra-precise 3D bump height metrology from 5µm to 250µm.
• Zero-Conversion Versatility:
  Handle diverse wafer and sawn wafer configurations seamlessly with minimum to zero tool conversion, maximizing uptime and production flexibility.
• Dual-Gate AI Detection:
  Combine high-speed rule-based algorithms with advanced AI models to catch subtle micro-defects reliably while drastically reducing false overkills.
• Vibration-Isolated Granite Stage:
  Eliminate cleanroom micro-vibrations with a heavy granite motion base to maintain sub-micron imaging stability during high-speed scanning.
• Multi-Illumination & Magnification:
  Optimize defect contrast across complex wafer topographies using multi-channel lighting (brightfield, darkfield, oblique) and dynamic multi-magnification optics.
• Auto Defect Classification (ADC) & Review:
  Instantly categorize defect types and log real-time quality metrics via intuitive review software for effortless offline verification and SPC tracking.
• Scalable Performance Upgrades:
  Future-proof your manufacturing line with a modular architecture that easily scales for higher optics resolution or speed boosts as your needs expand.