Wafer AOI Designed for Wafer and Sawn Wafer Configuration

Wafer AOI Designed for Wafer and Sawn Wafer Configuration

Description

Built for advanced semiconductor front-end and back-end packaging, the F2X Pro delivers rapid yield assurance and micro-defect detection across complex die surfaces, probe marks, saw lines, and bumps.

Features

• Wafer & Sawn Wafer Compatibility:
  Built to inspect both whole wafers and dicing film-mounted sawn wafers with minimum to zero mechanical tool conversion between product changes, maximizing equipment uptime.
• Comprehensive Multi-Process Defect Coverage:
  Inspects for surface contamination/scratches, probe mark integrity, sawing chipping/crack defects, and bump micro-anomalies (height, bridge, missing bumps) on a single platform.
• Hybrid Dual-Gate Detection (Rule & AI-Based):
  Combines high-speed, deterministic rule-based inspection algorithms with advanced AI deep-learning models to reliably identify subtle, non-standard defects while drastically reducing false overkills.
• High-Stability Optomechanical Foundation:
  Built on a heavy vibration-isolated granite motion stage that eliminates ambient shop-floor micro-vibrations, enabling sub-micron accuracy during high-speed scanning.
• Multi-Magnification & Multi-Illumination System:
  Integrates dynamic multi-channel illumination (brightfield, darkfield, oblique) and multi-magnification optical lenses to render fine defect contrast regardless of substrate reflectivity or topography.
• Auto Defect Classification (ADC) & Review Software:
  Includes built-in AI algorithms to instantly classify defect types and an intuitive review software interface for rapid offline verification and statistical process control (SPC) tracking.
• Scalable Performance Upgrades:
  Features a modular architecture that allows field upgrades for higher optics resolution, speed boosts, or expanded software capabilities as production requirements grow.