Substrate Package AOI Machine

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Capture critical micro-defects at high speed, guaranteeing zero-defect reliability and an uncompromised foundation for your semiconductor packaging.

High-Speed Line Scan Vision:
Employs high-resolution line scan technology to capture crisp, high-magnification images across large substrate surfaces without sacrificing line speed.
Simultaneous Top & Bottom Inspection:
Audits both upper and lower substrate surfaces in a single inline pass, eliminating the need for flipping mechanisms and reducing handling risks.
Brightfield & Darkfield Illumination:
Combines multi-angle lighting channels to effectively reveal flat surface anomalies (brightfield) as well as subtle edge cracks, scratches, and height variations (darkfield).
Auto Defect Classification (ADC):
Uses intelligent algorithms to automatically detect and categorize flaws in real time, removing operator subjectivity and streaming quality data into factory MES/SPC systems.
High-Throughput Efficiency:
Reaches process speeds of up to 300 SPH for standard 100x300mm substrates, keeping pace with high-volume production lines.
Integrated Reject Sorting Bin:
Automatically segregates non-conforming units into dedicated physical reject bins to guarantee zero defective escapes downstream.
Optional Reject Marking & Handling:
Offers versatile reject-marking add-ons, including micro-dot inking, permanent laser marking, or mechanical punching to permanently render failed units unusable.