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The
VI-3000 consists of two fully
intergrated subsystems - an
Automated Tube-to-tube Handler
and a 3-camera High Resolution
Vision Inspection System.
The single track handling system
moves the devices to be inspected
through the vision system in
a controlled manner. It positions
the devicesat each inspection
station and sorts the inspected
devices into the appropriate
output tubes. All operations
are performed in a manner which
protects the leads and contents
of the IC package from damage.
Devices are handled at a cycle
rate of approx. 7000 UPH.
The
inspection system consists of
3 cameras and optics interfaced
with
a computerized image processing
system. Specific inspection
routines enablethe user to program
criteria for coplanarity, lead
spacing and tweezetolerances.
The image processing system
digitizes images acquired by
the cameras and analyzes them
using the system’s sophisticated
software.Specific measurements
are taken and compared againt
pre-selected criteria to determine
a pass or fail decision. Finally,
the image processing
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| Handler
Capability & Specification |
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| Cycle Time |
>7000 UPH |
| MTBA |
45 min |
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High Through-Put
which Handles PDIP, To and
SOIC Devices |
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Meant For Mark, Lead and
Package Inspection |
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Input Stack Tube Up to 40
Plastic Tubes |
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Output Tube
Handler |
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3 Stations for Mark, Lead
and Package Inspection |
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Stepper Driven for Reject
Units |
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2 Tubes for Bent Lead Reject |
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1 Tube for Mark Reject |
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1 Tube for Package Reject |
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| Package type |
PDIP, TO and
SOIC Devices |
| Dimensions |
1700(L) x 650(W) x 1200(H) |
| Weight |
Approximately 150kg |
| Power |
110V A.C, 50Hz, Single
Phase, 15A |
| Air Supply |
4 kg/cm2 |
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| Camera Resolution
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752 x 582 Pixels |
| Sub-Pixel Resolution |
0.25 Pixel |
| System Accuracy
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0.025 mm |
| Inspection
Cycle Time |
60 milliseconds |
| GR&R |
<10 % |
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