machine vision inspection system
advanced machine vision inspection system
 

Flip Chip Package AOI (FCPI)

Flip Chip Package AOI

  Features
Combines 2D vision and 3D laser inspection In 1 system.
inspects for package alignment, surface defects, heat spreader height profile and true 3D warpage measurement.
equipped with tray loader & unloader and conveyor for inprocess inspection.
 
Specification